DocumentCode
2598798
Title
Physics of Failure Principles Applied to a Device Development Program
Author
Weston, T.C. ; Tomlinson, J.L.
Author_Institution
The Boeing Company, Aero-Space Division, Seattle, Washington
fYear
1964
fDate
Sept. 1964
Firstpage
191
Lastpage
199
Abstract
THIS paper describes a program to develop a high-ohms-per-square tantalum, thin film resistor. Several techniques of physics of failure were used. Among these was a random balance experiment using an accelerated life test as the measure of device reliability. A physics of failure analysis on failed items resulted in the rejection of several of the materials combinations. As a result, the expected life of the basic device was increased by a factor of over one hundred.
Keywords
Conducting materials; Fabrication; Failure analysis; Life estimation; Life testing; Physics; Resistors; Silicon; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Physics of Failure in Electronics, 1964. Third Annual Symposium on the
Conference_Location
Chicago, IL, USA
ISSN
0097-2088
Type
conf
DOI
10.1109/IRPS.1964.362287
Filename
4207641
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