Engineering model for interfacial stresses of a tri-material assembly with different temperatures in the layers

Author

Sujan, D. ; Murthy, M.V.V. ; Seetharamu, K.N. ; Hassan, A.Y.

Author_Institution

Sch. of Mech. Eng., Univ. of Sci. Malaysia, Pulau Pinang, Malaysia

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

526

Lastpage

533

Abstract

A model is proposed for the shearing and peeling stresses occurring at the interface of three thin bonded objects to account for different temperatures of the layers by incorporating two temperature ratio parameters. The results are presented for die, die attach and substrate as commonly found in electronic packaging. Both 2D and 3D models are considered for comparison of the analytical results with numerical simulation using finite element method. Both for shearing and peeling stress, the 3D simulation results shows better agreement with analytical solution compare to 2D model.

Keywords

assembling; electronics packaging; finite element analysis; interface phenomena; internal stresses; die attach; electronic packaging; engineering model; finite element; interfacial stress; layer temperature; linear temperature gradient; peeling stress; shearing stress; temperature ratio; thermal expansion coefficient; thin bonded objects; trimaterial assembly; Analytical models; Assembly; Bonding; Electronics packaging; Finite element methods; Microassembly; Numerical simulation; Shearing; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396665

Filename

1396665