Microwave/millimeter devices for multilayer 3D-System-On-Packaging (SOP) technology using Liquid Crystal Polymer (LCP) material

Author

Boadu, Edwin O. ; Elsir, Mohammed Tag ; Hossin, M. Altab ; Amoah, Anthony

Author_Institution

Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China

fYear

2012

fDate

19-20 April 2012

Firstpage

1

Lastpage

4

Abstract

We describe a new class of microwave/millimeter device utilizing Liquid Crystal Polymer (LCP) material which has showed a combination of good electrical and mechanical properties. This paper presents the design and simulation of a fully System-On-Package (SOP) antenna module that will be suitable for 5GHz WLAN application with high performance. The proposed antenna is printed on a flexible LCP layer, protruding from a rigid multilayer organic substrate. The shielding effect of the metal case which protects the module circuitry from the near fields of the antenna was also taken care of during the design.

Keywords

electromagnetic shielding; flexible displays; liquid crystal polymers; microstrip antennas; millimetre wave devices; system-on-package; wireless LAN; 3D-SOP technology; LCP material; SOP antenna module; WLAN application; antenna near fields; electrical property; flexible LCP layer; frequency 5 GHz; liquid crystal polymer material; mechanical property; metal case shielding effect; microwave devices; millimeter devices; module circuitry; multilayer 3D-system-on-packaging technology; rigid multilayer organic substrate; system-on-package antenna module; Antenna measurements; Antennas; Metals; Microwave circuits; Microwave devices; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Circuits and System Technology (MMWCST), 2012 International Workshop on

Conference_Location

Chengdu

Print_ISBN

978-1-4673-1893-8

Type

conf

DOI

10.1109/MMWCST.2012.6238152

Filename

6238152