Title :
Small form factor and low profile quad-band System-in-Package (SiP) module
Author :
Shevelov, M. ; Sieroshtan, V. ; Ruban, O. ; Burygin, A. ; Komakha, P. ; Aleksieiev, O. ; Chayka, O. ; Sevskiy, G. ; Stoehr, P. ; Heide, P. ; Vossiek, Martin
Author_Institution :
Epcos AG (TDK-EPC), Munich, Germany
Abstract :
Summary form only given, as follows. A very small form factor and low profile quad-band System-in-Package (SiP) module based on the state-of-the-art 65nm CMOS IC is presented. The SiP module provides full function of 2.4G and 5G WLAN, Bluetooth, GPS, FM radio and FM transmitter. The highly integrated device incorporates single chip, RF front-end module, filters for WLAN and GPS, number of SMD components and EMI shielding. Very compact SiP solution (9.5×11.9×1.2mm3) forms a complete multi-functional wireless communication system.
Conference_Titel :
Microwave Symposium Digest (MTT), 2011 IEEE MTT-S International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-61284-754-2
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2011.5973562
