Title :
Design, manufacture and testing of a low-cost micro-channel cooling device
Author :
Pang, A.J. ; Desmulliez, M.P.Y. ; Leonard, M. ; Dhariwal, R.S. ; Reuben, R.L. ; Holmes, A.S. ; Hong, G. ; Pullen, K.R. ; Waldron, F. ; Slattery, O. ; Rencz, M. ; Emerson, D.R. ; Barber, R.W.
Author_Institution :
Sch. of Eng. & Phys. Sci., Heriot Watt Univ., Edinburgh
Abstract :
The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-lithography, electroforming, replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented
Keywords :
LIGA; channel flow; cooling; electron device manufacture; electron device testing; electronics packaging; finite element analysis; flow measurement; forced convection; heat sinks; microchannel plates; nickel; Ni; UV-LIGA; UV-electroforming; UV-lithography; UV-replication; flow pressure head measurement; forced convection; hydraulic performance; low-cost micro-channel cooling device; mass flow rate; microchannel cooling plate fabrication; microchannel cooling plate testing; microelectronic packaging cooling applications; nickel-based micro-channel cooling plate; two-layer electroforming process; Cooling; Fabrication; Fluid flow measurement; Glass; Job shop scheduling; Manufacturing; Microchannel; Microelectronics; Packaging; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Conference_Location :
Singapore
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396671
