DocumentCode :
2599005
Title :
Averaging approach for microchannel heat sinks subjected to the uniform wall temperature condition
Author :
Kim, Dong-Kwon ; Kim, Sung Jin
Author_Institution :
Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea
fYear :
2004
fDate :
8-10 Dec. 2004
Firstpage :
569
Lastpage :
574
Abstract :
The present paper is devoted to the modeling method based on an averaging approach for thermal analysis of microchannel heat sinks subjected to the uniform wall temperature condition. Solutions for velocity and temperature distributions are presented using the averaging approach. When the aspect ratio of the microchannel is higher than 1, these solutions accurately evaluate thermal resistances of heat sinks. Asymptotic solutions for velocity and temperature distributions at the high-aspect-ratio limit are also presented by using the scale analysis. Asymptotic solutions are simple, but shown to predict thermal resistances accurately when the aspect ratio is higher than 10. The effects of the aspect ratio and the porosity on the friction factor and the Nusselt number are presented. Characteristics of the thermal resistance of microchannel heat sinks are also discussed.
Keywords :
friction; heat sinks; modelling; numerical analysis; porosity; temperature distribution; thermal analysis; thermal resistance; Nusselt number; aspect ratio; asymptotic solutions; averaging approach; friction factor; microchannel heat sinks; porosity; temperature distribution; thermal analysis; thermal resistance; uniform wall temperature condition; velocity distribution; Electronic components; Electronics cooling; Heat sinks; Heat transfer; Immune system; Microchannel; Predictive models; Resistance heating; Temperature distribution; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
Type :
conf
DOI :
10.1109/EPTC.2004.1396672
Filename :
1396672
Link To Document :
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