Unsteady thermal behaviour of electronic chips inside FC-72 cooled channel

Author

Bhowmik, H. ; Tou, K.W. ; Tso, C.P.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ.

fYear

2004

fDate

8-10 Dec. 2004

Firstpage

581

Lastpage

585

Abstract

Experimental analysis of transient natural convection heat transfer from a four-in-line chip module that are flush-mounted to one wall of a vertical rectangular channel are performed for the liquid coolant of FC-72. The heat flux ranges from 1 kW/m² to 6 kW/m ². The effect of heat fluxes and chip numbers are investigated. The results indicate that the heat transfer coefficient is affected strongly by the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime. The transient correlation for overall data recommended is Nu_l = 0.47(Fo)^-0.35(Ra_l)^1/4

Keywords

channel flow; coolants; cooling; multichip modules; natural convection; FC-72 cooled channel; electronic chips; experimental analysis; four-in-line chip module; heat flux; heat transfer coefficient; liquid coolant; transient correlation; transient natural convection heat transfer; unsteady thermal behaviour; Coolants; Electronic packaging thermal management; Electronics cooling; Equations; Heat transfer; Liquid cooling; Maintenance; Telecommunication computing; Temperature; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th

Conference_Location

Singapore

Print_ISBN

0-7803-8821-6

Type

conf

DOI

10.1109/EPTC.2004.1396674

Filename

1396674