DocumentCode :
2599211
Title :
CMOS integrated digital RF MEMS capacitors
Author :
Natarajan, Saravana P. ; Cunningham, Shawn J. ; Morris, Arthur S., III ; Dereus, Dana R.
Author_Institution :
wiSpry Inc., Irvine, CA, USA
fYear :
2011
fDate :
17-19 Jan. 2011
Firstpage :
173
Lastpage :
176
Abstract :
A zero-level packaged, digitally switched, RF MEMS capacitor array has been developed within a mass production capable HV RF CMOS process. These RF MEMS capacitors are grouped in flip-chip cells that exhibit a high quality factor of 87 at 2 GHz, a tuning ratio of almost 10 to 1, a self resonant frequency greater than 5 GHz, and operate using a 3.3 V supply voltage. These arrays are ideally suited for front-end tuning applications in portable wireless devices such as cell phones.
Keywords :
CMOS integrated circuits; Q-factor; capacitors; charge pump circuits; flip-chip devices; mass production; micromechanical devices; mobile handsets; tuning; RF CMOS process; cell phones; digital RF MEMS capacitors; flip-chip cells; frequency 2 GHz; front-end tuning; integrated charge pump; mass production; quality factor; tuning ratio; voltage 3.3 V; CMOS integrated circuits; Capacitance; Capacitors; Metals; Micromechanical devices; Radio frequency; Tuning; MEMS; MEMS capacitors; MEMS tuners; RF CMOS; mobile phone tuners; variable capacitors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2011 IEEE 11th Topical Meeting on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-8060-9
Type :
conf
DOI :
10.1109/SIRF.2011.5719327
Filename :
5719327
Link To Document :
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