Title :
Reliability Phenomena in Aluminum Metalizations on Silicon Dioxide
Author :
Berger, W.M. ; Keen, R.S. ; Schnable, G.L.
Author_Institution :
Philco Corporation, Lansdale Division, Lansdale, Pennsylvania
Keywords :
Aluminum; Circuit testing; Conductivity; Dielectrics; Integrated circuit reliability; Life testing; MOS devices; Silicon compounds; Temperature; Thermal stresses;
Conference_Titel :
Physics of Failure in Electronics, 1965. Fourth Annual Symposium on the
Conference_Location :
Chicago, IL, USA
DOI :
10.1109/IRPS.1965.362312
