DocumentCode :
2599505
Title :
Reduction of impedance and feedthrough parasitics of RF micromechanical resonators
Author :
Dewdney, Julio ; Wu, I-Tsang ; Wei, Mian ; Wang, Jing
Author_Institution :
Center for Wireless & Microwave Inf. Syst., Univ. of South Florida, Tampa, FL, USA
fYear :
2011
fDate :
17-19 Jan. 2011
Firstpage :
165
Lastpage :
168
Abstract :
Having been demonstrated at frequencies up to 6.2 GHz with measured Q´s >; 4,000, micromechanical resonators hold great promise for enabling on-chip high-Q passives needed in wireless communication systems. However, the acceptance of such devices in present-day transceivers has been hindered by their excessive motional impedances and feedthrough parasitics that prevent direct integration with other RF subsystems and IC´s. This paper reviews strategies for alleviating these issues with focus on the employment of transducers with improved conversion efficiency enabled by atomic layer deposition (ALD) process. Additionally, arrays of mechanically-coupled resonators have been developed to enhance the overall output signal strength of the composite resonators thus lowering the effective motional impedance. Moreover, on-chip Faraday cages were employed to mitigate the effect of the feedthrough noise of the substrate parastics from the motional current of the micromechanical resonator.
Keywords :
Q-factor; atomic layer deposition; micromechanical resonators; radio transceivers; wireless channels; RF micromechanical resonators; atomic layer deposition; composite resonators; feedthrough noise; feedthrough parasitics; impedance reduction; on-chip Faraday cages; on-chip high-Q passives; transceivers; wireless communication; Frequency measurement; Impedance; Micromechanical devices; Radio frequency; Resonant frequency; Substrates; Wireless communication; ALD; Feedthrough Parasitics; Micromechanical Resonator; Motional Impedance; Quality Factor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2011 IEEE 11th Topical Meeting on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-8060-9
Type :
conf
DOI :
10.1109/SIRF.2011.5719343
Filename :
5719343
Link To Document :
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