Title :
Transient simulation of solder joint fracturing under impact test
Author :
Chang-Lin Yen ; Lai, Yi-Shao
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan
Abstract :
In this paper, transient deformation and fracturing of solder joints subjected to the impact load are investigated numerically. The three-dimensional finite element analysis applies the explicit time integration scheme and incorporates as well contact, fracturing and fragmentation mechanisms to predict the transient response and the failure mode of the solder joint subjected to an impact load.
Keywords :
electronics packaging; finite element analysis; impact testing; solders; 3D finite element analysis; contact mechanism; explicit time integration scheme; fracturing mechanism; fragmentation mechanisms; impact loading; impact test; solder joint failure mode; solder joint fracturing; transient deformation; transient response; transient simulation; Electronics industry; Electronics packaging; Failure analysis; Finite element methods; Soldering; Surface cracks; Surface finishing; System testing; Transient analysis; Vehicles;
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
DOI :
10.1109/EPTC.2004.1396696
