• DocumentCode
    2599705
  • Title

    A 22W Ku band power amplifier based on internal-matched 6mm GaN HEMTs single chip

  • Author

    Luo, W.J. ; Chen, X.J. ; Pang, L. ; Yuan, T.T. ; Liu, X.Y.

  • Author_Institution
    Key Lab. of Microelectron. Devices & Integrated Technol., Inst. of Microelectron., Beijing, China
  • fYear
    2012
  • fDate
    19-20 April 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A Ku-band power amplifier is successfully developed with an internal-matched single chip 6mm AlGaN/GaN high electron mobility transistors (HEMTs). LCL network together with microstrip circuits are used to directly match the impedance of the 6mm GaN HEMTs to 50Ohm without using power combiner. Under the pulsed condition (100μs, 10%), the developed GaN HEMTs power amplifier delivers a 22W saturated output power with 7.6dB linear gain and 26.8% maximum power-added efficiency (PAE) with a drain voltage of 32V and at the frequency of 13.7GHz. To our best knowledge, the achieved high performance power amplifier is the state-of-the-art result ever reported for internal-matched 6mm gate width single chip GaN-based hybrid microwave integrated power amplifier at Ku-band.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; microwave power amplifiers; AlGaN-GaN; HEMT power amplifier; Ku-band power amplifier; LCL network; frequency 13.7 GHz; high electron mobility transistor; internal-matched HEMT single chip; microstrip circuit; power 22 W; power combiner; power-added efficiency; single chip hybrid microwave integrated power amplifier; size 6 mm; time 100 mus; voltage 32 V; Aluminum gallium nitride; Gain; Gallium nitride; HEMTs; MODFETs; Power amplifiers; Power generation; AlGaN/GaN; Gain; HEMTs; Ku band; internal-matched; power amplifier;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Circuits and System Technology (MMWCST), 2012 International Workshop on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4673-1893-8
  • Type

    conf

  • DOI
    10.1109/MMWCST.2012.6238195
  • Filename
    6238195