DocumentCode :
2599812
Title :
Characterization of organic multi-mode optical waveguides for the electro-optical printed circuit board (EOPCB)
Author :
Shen, Li-Cheng ; Lo, Wei-Chung ; Chang, Hsiang-Hung ; Fu, Huan-Chun ; Lee, Yuan-Chang ; Chen, Yu-Chih ; Chang, Shu-Ming ; Chen, Wun-Yan ; Chou, Ming-Chieh
Author_Institution :
Adv. Packaging Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear :
2004
fDate :
8-10 Dec. 2004
Firstpage :
753
Lastpage :
758
Abstract :
In this paper, characteristics of optical propagation of the vertical cavity surface emitting laser (850 nm VCSEL) through organic multi-mode optical waveguides are studied. Based on the typical optical loss measurement and the beam profile analysis of optical power distribution, the variation and co-relation between the VCSEL light source and the waveguide outputs are explored. Key factors of waveguide design for EOPCB integration, including the coupling scheme, geometric dimensions, bending, thermal effects, reliability, and etc., are further characterized based on experimental results. A 2.5Gbps optical interconnection prototype using film-type organic array waveguide is also demonstrated here for short reach data-communication at 12 cm.
Keywords :
data communication; electro-optical devices; light propagation; optical interconnections; optical waveguides; organic compounds; printed circuits; surface emitting lasers; 12 cm; 2.5 Gbits/s; 850 nm; EOPCB integration; beam profile analysis; data communication; electro-optical printed circuit board; film-type organic array waveguide; optical interconnection; optical loss measurement; optical power distribution; optical propagation; organic multimode optical waveguides; vertical cavity surface emitting laser; Electrooptical waveguides; Geometrical optics; Optical arrays; Optical films; Optical interconnections; Optical propagation; Optical waveguides; Printed circuits; Stimulated emission; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2004. EPTC 2004. Proceedings of 6th
Print_ISBN :
0-7803-8821-6
Type :
conf
DOI :
10.1109/EPTC.2004.1396708
Filename :
1396708
Link To Document :
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