• DocumentCode
    2600139
  • Title

    Hybrid telemetric MEMS for high temperature measurements into harsh industrial environments

  • Author

    Marioli, D. ; Sardini, Emilio ; Serpelloni, Mauro ; Ando, B. ; Baglio, S. ; Savalli, Nicolo ; Trigona, C.

  • Author_Institution
    Dip. di Elettron. per l´Autom., Univ. of Brescia, Brescia, Italy
  • fYear
    2009
  • fDate
    5-7 May 2009
  • Firstpage
    1423
  • Lastpage
    1428
  • Abstract
    A temperature sensor that could be interrogated contactless represents an attractive solution for measurements into harsh environments such as in presence of high temperatures that do not permit the correct working of electronics. This paper discusses a telemetric system consisting of two coupled planar inductors, which constitute a coupled transformer with the primary one connected to the measurement electronics and the secondary one to a capacitive MEMS sensor that is designed for high-temperature environments. The proposed hybrid sensor is composed by the capacitive MEMS bonded to the planar inductor. The hybrid sensor behaves as an LC resonant circuit in which the MEMS represents the capacitance and the planar inductor is the inductance. The whole system has been tested in the laboratory and several results are reported. The proposed telemetric temperature system can be a solution for efficiency monitoring and predictive maintenance for harsh and complex environments.
  • Keywords
    capacitive sensors; inductors; micromechanical devices; telemetry; temperature measurement; temperature sensors; LC resonant circuit; capacitive sensor; coupled planar inductors; harsh industrial environment; hybrid telemetric MEMS sensor design; measurement electronics; temperature measurement; Bonding; Capacitive sensors; Coupling circuits; Inductors; Micromechanical devices; RLC circuits; Sensor systems; Telemetry; Temperature measurement; Temperature sensors; Contactless Telemetric System; High Temperature Measurement; MEMS; Predictive Maintenance; Process Control; Wireless System;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference, 2009. I2MTC '09. IEEE
  • Conference_Location
    Singapore
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-3352-0
  • Type

    conf

  • DOI
    10.1109/IMTC.2009.5168678
  • Filename
    5168678