DocumentCode
2600777
Title
Junction Seal Development for the Beam-Lead Sealed-Junction Technology
Author
Bergh, A.A. ; Schneer, G.H.
Author_Institution
Bell Telephone Labs, Murray Hill, N. J.
fYear
1967
fDate
Nov. 1967
Firstpage
95
Lastpage
95
Abstract
Most high reliability semiconductor devices are encapsulated in hermetically sealed metal enclosures. Lower cost, accompanied, however, by lower reliability, has been obtained with plastic encapsulations. A junction seal has been developed which consists of a metal-insulator-silicon system of materials comprised of the beam-lead contact(1) in combination with a silinitride overcoat(2) on silicon planar devices. The junction seal offers both low cost technology and high reliability(3) equivalent to that of the hermetically sealed metal encapsulation.
Keywords
Costs; Encapsulation; Hermetic seals; Inorganic materials; Metal-insulator structures; Plastics; Sealing materials; Semiconductor device reliability; Semiconductor devices; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1967. Sixth Annual
Conference_Location
Los Angeles, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1967.362398
Filename
4207761
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