Title :
Junction Seal Development for the Beam-Lead Sealed-Junction Technology
Author :
Bergh, A.A. ; Schneer, G.H.
Author_Institution :
Bell Telephone Labs, Murray Hill, N. J.
Abstract :
Most high reliability semiconductor devices are encapsulated in hermetically sealed metal enclosures. Lower cost, accompanied, however, by lower reliability, has been obtained with plastic encapsulations. A junction seal has been developed which consists of a metal-insulator-silicon system of materials comprised of the beam-lead contact(1) in combination with a silinitride overcoat(2) on silicon planar devices. The junction seal offers both low cost technology and high reliability(3) equivalent to that of the hermetically sealed metal encapsulation.
Keywords :
Costs; Encapsulation; Hermetic seals; Inorganic materials; Metal-insulator structures; Plastics; Sealing materials; Semiconductor device reliability; Semiconductor devices; Semiconductor materials;
Conference_Titel :
Reliability Physics Symposium, 1967. Sixth Annual
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/IRPS.1967.362398
