Title :
Thermal Evaluations of Diffused-Junction Semiconductors
Author_Institution :
IBM, East Fishkill, New York
Abstract :
This method consists of two parts: (1) determination of thermal resistance from the diffused junction to a thermal reference plane through the use of the diode equation relation; and (2) the thermal resistance from the diffused junction to the joining pad and the thermal resistance from the pad at the substrate surface to the substrate bottom using a thick film cobalt oxide thermistor.
Keywords :
Cobalt; Current measurement; Equations; Heat sinks; Substrates; Surface resistance; Temperature; Thermal resistance; Thermistors; Thick films;
Conference_Titel :
Reliability Physics Symposium, 1967. Sixth Annual
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/IRPS.1967.362400
