Title :
Automotive Electronics - Enabling the future of individual mobility
Author_Institution :
Robert Bosch GmbHm, Reutlingen
Abstract :
Automotive electronics increased in functionality and complexity heavily during the past decades and was undergoing major changes in architecture, functionality, networking capabilities - and there are many new systems coming up soon. The harsh environment in cars and the high requirements on quality of all components led to many automotive specific solutions for semiconductors, their packaging, and the process technologies used to manufacture them. Apart from this manufacturing of automotive semiconductors needs focus on test and release procedures and on specific logistic process. In this paper we will give an overview on automotive specific requirements for semiconductors and their manufacturers.
Keywords :
automobile industry; automotive electronics; electronic equipment testing; electronics packaging; manufacturing processes; automotive electronics; automotive semiconductors manufacturing; cars; manufacture process technologies; networking capabilities; semiconductors packaging; specific logistic process; test procedures; Actuators; Automotive electronics; Automotive engineering; Centralized control; Ethernet networks; Fuels; Manufacturing processes; Packaging; Semiconductor device manufacture; Valves;
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
DOI :
10.1109/IEDM.2007.4418850
