Can Plastic Encapsuiated Microcircuits Provide Reliability with Economy?

Associated with plastic encapsulation for micro-circuits is a set of failure mechanisms which may make these devices unsuitable for high reliability use. Various experiments, as well as conventional environmental testing, have been performed on a wide variety of plastic encapsulated ICs, as well as on equivalent ceramic types. The results elucidate fundamental limitations of plastic packaging, reveal mechanisms of failure, and suggest departures from conventional military screening and qualification procedures which would be essential to assurance of acceptable devices.