DocumentCode
2601782
Title
Factors in High Reliability Wire Bonding
Author
Davis, Dan
Author_Institution
Research and Development Laboratory, Fairchild Camera and Instrument Corporation, Palo Alto, California 94304
fYear
1970
fDate
25659
Firstpage
170
Lastpage
176
Abstract
The production of devices with highest reliability is the result of optimum specifications on equipment and piece parts together with a process which has been selected from knowledge of how the operating variables affect the bond. This knowledge must be developed on each bonding system by a series of test samples, with suitable curves developed, which enable the engineer to select the process.
Keywords
Bonding; Cameras; Contracts; Electric shock; Instruments; Knowledge engineering; Laboratories; Production; System testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1970.362454
Filename
4207820
Link To Document