• DocumentCode
    2601831
  • Title

    Observations on the Reliability of thin Film Nickel-Chromium Resisiors

  • Author

    Philofsky, E. ; Stickney, G. ; Ravi, K.V.

  • Author_Institution
    Motorola, Inc., Phoenix, Arizona
  • fYear
    1970
  • fDate
    25659
  • Firstpage
    191
  • Lastpage
    199
  • Abstract
    The reliability of 150Å thick Ni-Cr films used for resistors was studied. It was found that these films deposited on SiO2 were continuous, void-free, and not susceptible to intermetallic formation with aluminum during normal device processing. No evidence of electromigration was found in these films after continuous powering at current densities up to 5.9 × 106 amps/cm2 for 1000 hours; nor were failures found for power cycling at these current densities for up to 7.2 × 109 cycles.
  • Keywords
    Aluminum; Chromium; Conductive films; Current density; Intermetallic; Resistors; Silicon; Substrates; Temperature; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1970. 8th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1970.362457
  • Filename
    4207823
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2601831