• DocumentCode
    2601995
  • Title

    Simulation of Electron Transport in High-Mobility MOSFETs: Density of States Bottleneck and Source Starvation

  • Author

    Fischetti, M.V. ; Wang, L. ; Yu, B. ; Sachs, C. ; Asbeck, P.M. ; Taur, Y. ; Rodwell, M.

  • Author_Institution
    Univ. of Massachusetts, Amherst
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    20 nm InGaAs-based MOSFETs are studied using dc and transient Monte Carlo simulations and self-consistent Schrodinger-Poisson solutions accounting for nonparabolic corrections. The latter simulations show that nonparabolicity can boost the carrier concentration in the InGaAs channel by up to 35% with respect to calculations based on parabolic models, while Monte Carlo simulations show that an optimization of the source, channel, and source/channel regions can significantly improve the performance of the devices. This optimization overcomes a problem that results from the low density- of-states (DOS) in materials with low effective mass, which appears in the quasi-ballistic limit: The inability of the source region to sustain a large flow of carriers in ´longitudinal´ velocity states in the channel (´source starvation´), unless the momentum relaxation rate and/or the doping density in the source are sufficiently large.
  • Keywords
    MOSFET; Monte Carlo methods; carrier density; effective mass; gallium arsenide; indium compounds; semiconductor doping; InGaAs; carrier concentration; density of states; doping density; effective mass; electron transport; high-mobility MOSFETs; longitudinal velocity states; momentum relaxation; nonparabolic corrections; parabolic models; quasiballistic limit; transient Monte Carlo simulations; CMOS technology; Capacitance; Charge carrier density; Computational modeling; Effective mass; Electrons; FETs; Indium gallium arsenide; MOSFETs; Scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4418876
  • Filename
    4418876