DocumentCode
2602149
Title
Power Handling Capability and Temperature Distribution for Different Transistor Structures
Author
Arlt, Manfred ; Grasser, Leo ; Gückel, Helmut ; Rücker, Dieter
Author_Institution
Siemens AG; Munich; Germany
fYear
1970
fDate
25659
Firstpage
298
Lastpage
301
Abstract
To achieve good high-power performance, power transistors are often constructed having a fine interdigitated structure. These transistors are very susceptible to second breakdown, however, particulary at high voltage. A simple method of estimating the temperature distribution in the transistor chip made it possible to design structures with up to seven-fold better pulses power handling capability.
Keywords
Aluminum; Breakdown voltage; Electric breakdown; Metallization; Pulse measurements; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1970.362474
Filename
4207840
Link To Document