• DocumentCode
    2602149
  • Title

    Power Handling Capability and Temperature Distribution for Different Transistor Structures

  • Author

    Arlt, Manfred ; Grasser, Leo ; Gückel, Helmut ; Rücker, Dieter

  • Author_Institution
    Siemens AG; Munich; Germany
  • fYear
    1970
  • fDate
    25659
  • Firstpage
    298
  • Lastpage
    301
  • Abstract
    To achieve good high-power performance, power transistors are often constructed having a fine interdigitated structure. These transistors are very susceptible to second breakdown, however, particulary at high voltage. A simple method of estimating the temperature distribution in the transistor chip made it possible to design structures with up to seven-fold better pulses power handling capability.
  • Keywords
    Aluminum; Breakdown voltage; Electric breakdown; Metallization; Pulse measurements; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1970. 8th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1970.362474
  • Filename
    4207840