DocumentCode :
2602149
Title :
Power Handling Capability and Temperature Distribution for Different Transistor Structures
Author :
Arlt, Manfred ; Grasser, Leo ; Gückel, Helmut ; Rücker, Dieter
Author_Institution :
Siemens AG; Munich; Germany
fYear :
1970
fDate :
25659
Firstpage :
298
Lastpage :
301
Abstract :
To achieve good high-power performance, power transistors are often constructed having a fine interdigitated structure. These transistors are very susceptible to second breakdown, however, particulary at high voltage. A simple method of estimating the temperature distribution in the transistor chip made it possible to design structures with up to seven-fold better pulses power handling capability.
Keywords :
Aluminum; Breakdown voltage; Electric breakdown; Metallization; Pulse measurements; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1970. 8th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1970.362474
Filename :
4207840
Link To Document :
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