• DocumentCode
    2602251
  • Title

    Reliability issues and scaling projections for phase change non volatile memories

  • Author

    Lacaita, A.L. ; Ielmini, D.

  • Author_Institution
    Politecnico di Milano, Milan
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    While the semiconductor industry is gaining confidence in the phase change memory (PCM) technology, many issues about reliability and scaling limitations are still debated. PCM reliability is mainly affected by crystallization and relaxation mechanisms in the metastable amorphous structure. The ultimate scaling limit for PCM is also believed to be determined by the structural stability of nm-sized amorphous volumes. To improve the reliability and to predict the ultimate scaling perspectives of PCM technology, a comprehensive understanding of crystallization and relaxation physics is necessary. This work reviews the current understanding of the reliability properties of PCMs. The possibility to tailor the cell reliability by composition changes in the chalcogenide material will be addressed. Experimental results about size-dependent crystallization in amorphous chalcogenide materials will be finally discussed.
  • Keywords
    amorphous state; chalcogenide glasses; crystallisation; integrated circuit reliability; phase change materials; random-access storage; stability; PCM reliability; chalcogenide material; metastable amorphous structure; phase change memory technology; phase change non volatile memories; relaxation mechanisms; reliability issues; semiconductor industry; size-dependent crystallization; structural stability; ultimate scaling limitations; Amorphous materials; Crystalline materials; Crystallization; Electronics industry; Metastasis; Phase change materials; Phase change memory; Physics; Semiconductor device reliability; Structural engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4418890
  • Filename
    4418890