DocumentCode
2602382
Title
Plane bounce in high-speed single-ended signaling I/O interfaces
Author
Oh, Dan
Author_Institution
Rambus Inc., Sunnyvale, CA, USA
fYear
2011
fDate
23-26 Oct. 2011
Firstpage
3
Lastpage
6
Abstract
Single-ended signaling is a popular choice for memory interface designs, due to its low pin-count requirement and slow DRAM process technology. Single-ended signaling requires a good current return path, in order to maintain high signal quality. Commonly used single-ended signaling schemes require both power and ground current return paths. In high-density memory interface systems, not all of the signals can be routed using a stripline with both power and ground planes. Using other non-stripline routing configurations can lead to voltage noise at some of the reference planes; referred to as plane bounce. This paper demonstrates that, while plane bounce may be significant in amplitude, its impact on the data signal is not as critical as previously thought. Various channel topologies are used to support this assertion.
Keywords
DRAM chips; computer interfaces; input-output programs; DRAM process technology; channel topologies; ground current return paths; high-density memory interface systems; high-speed single-ended signaling I/O interfaces; nonstripline routing configurations; plane bounce; voltage noise; Inductance; Microstrip; Noise; Resistors; Stripline; Transmission line measurements; Voltage measurement; SSN; ground bounce; mutiple reference planes; plane bounce; reference voltage; simultaneous switching noise; supply bounce;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location
San Jose, CA
ISSN
pending
Print_ISBN
978-1-4244-9398-2
Electronic_ISBN
pending
Type
conf
DOI
10.1109/EPEPS.2011.6100170
Filename
6100170
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