• DocumentCode
    2602382
  • Title

    Plane bounce in high-speed single-ended signaling I/O interfaces

  • Author

    Oh, Dan

  • Author_Institution
    Rambus Inc., Sunnyvale, CA, USA
  • fYear
    2011
  • fDate
    23-26 Oct. 2011
  • Firstpage
    3
  • Lastpage
    6
  • Abstract
    Single-ended signaling is a popular choice for memory interface designs, due to its low pin-count requirement and slow DRAM process technology. Single-ended signaling requires a good current return path, in order to maintain high signal quality. Commonly used single-ended signaling schemes require both power and ground current return paths. In high-density memory interface systems, not all of the signals can be routed using a stripline with both power and ground planes. Using other non-stripline routing configurations can lead to voltage noise at some of the reference planes; referred to as plane bounce. This paper demonstrates that, while plane bounce may be significant in amplitude, its impact on the data signal is not as critical as previously thought. Various channel topologies are used to support this assertion.
  • Keywords
    DRAM chips; computer interfaces; input-output programs; DRAM process technology; channel topologies; ground current return paths; high-density memory interface systems; high-speed single-ended signaling I/O interfaces; nonstripline routing configurations; plane bounce; voltage noise; Inductance; Microstrip; Noise; Resistors; Stripline; Transmission line measurements; Voltage measurement; SSN; ground bounce; mutiple reference planes; plane bounce; reference voltage; simultaneous switching noise; supply bounce;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-9398-2
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EPEPS.2011.6100170
  • Filename
    6100170