Title :
Design strategies for processor, chip/package co-design (M-VI)
Author :
Franzon, Paul ; Liu, En-Xiao
Author_Institution :
North Carolina State Uni., Raleigh, USA
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100173
