DocumentCode :
2602455
Title :
Deriving voltage tolerance specification for processor circuit design
Author :
Zhou, Tingdong ; Friedrich, Joshua D. ; Becker, Wiren D.
Author_Institution :
IBM Syst. & Technol. Group, Austin, TX, USA
fYear :
2011
fDate :
23-26 Oct. 2011
Firstpage :
17
Lastpage :
20
Abstract :
A well defined power supply tolerance specification is very important for designing processor circuits with sufficient performance margin. We introduce a design flow to derive the voltage tolerance specification by including power noise components due to the significant contributors, namely, voltage drop, voltage gradient, middle frequency chip package resonance noise, high frequency simultaneous switching noise (SSN), and voltage regulation module (VRM) tolerance. This method has been serving well for power tolerance specifications of multiple generations of IBM processor designs. However, the methodology needs further refinement to design the off-chip serial interfaces. As the interfaces are increasing in frequency, the voltage levels and swings are minimized to meet the performance criteria of maximizing the data transfer rate per watt.
Keywords :
integrated circuit design; integrated circuit noise; integrated circuit packaging; microprocessor chips; power supply circuits; IBM processor designs; data transfer rate; high frequency simultaneous switching noise; middle frequency chip package resonance noise; off chip serial interface; power noise component; power supply tolerance; processor circuit design; voltage drop; voltage gradient; voltage regulation module tolerance; voltage tolerance specification; Capacitors; Jitter; Noise; Random access memory; Resistance; Resonant frequency; System-on-a-chip; Power integrity; voltage tolerance specification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
ISSN :
pending
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
Type :
conf
DOI :
10.1109/EPEPS.2011.6100174
Filename :
6100174
Link To Document :
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