Title :
Impact Ionization Nanowire Transistor with Multiple-Gates, Silicon-Germanium Impact Ionization Region, and Sub-5 mV/decade Subtheshold Swing
Author :
Toh, Eng-Huat ; Wang, Grace Huiqi ; Zhu, Ming ; Shen, Chen ; Chan, Lap ; Guo-Qiang Lo ; Chih-Hung Tung ; Sylvester, Dennis ; Heng, Chun-Huat ; Samudra, Ganesh ; Yeo, Yee-Chia
Author_Institution :
Nat. Univ. of Singapore, Singapore
Abstract :
We report the first demonstration of an Impact Ionization nanowire multiple-gate field-effect transistor (I-MuGFET or I-FinFET). Excellent subthreshold swing of sub-5 mV/decade at room temperature was achieved. The multiple- gate structure enhances the impact ionization rate in the fin or nanowire channel, reduces the breakdown voltage and improves device performance. A silicon-germanium (SiGe) impact ionization region (I-region) is integrated on a Si or SiGe nanowire to enhance performance and reduce the breakdown voltage. A record low breakdown voltage of -4.75 V is achieved for SiGe nanowire device. Complementary pair of I-FinFETs were realized. The lower electron and hole impact-ionization threshold energy of SiGe greatly enhances the drive current of n- and p-channel devices by 3 and 2.4 folds, respectively.
Keywords :
Ge-Si alloys; MOSFET; impact ionisation; nanoelectronics; nanowires; semiconductor device breakdown; I-FinFET; I-MuGFET; Si-Ge; SiGe nanowire device; breakdown voltage; drive current enhancement; electron-hole impact-ionization threshold energy; impact ionization nanowire transistor; impact ionization rate; multiple-gate field-effect transistor; n- channel devices; nanowire channel; p-channel devices; silicon-germanium impact ionization region; temperature 293 K to 298 K; voltage -4.75 V; Charge carrier processes; Electric potential; Energy consumption; FETs; Germanium silicon alloys; Impact ionization; Microelectronics; Nanoscale devices; Silicon germanium; Temperature;
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
DOI :
10.1109/IEDM.2007.4418900