Title :
Wireless RF data communications using 60 GHz antennas in Multi-Core systems
Author :
Yeh, Ho-Hsin ; Hiramatsu, Nobuki ; Melde, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
Abstract :
Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip- chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.
Keywords :
antenna radiation patterns; ceramic packaging; flip-chip devices; microprocessor chips; millimetre wave antennas; radiocommunication; antenna configuration; antenna in package solution; artificial magnetic conductor; azimuth plane signal transmission; flip-chip technology; free space wireless transmission; frequency 60 GHz; ground shielded structures; high radiation efficiency; low temperature cofired ceramic superstrate; multichip multicore architecture; wireless RF data communications; Antenna radiation patterns; Dipole antennas; Reflection; Silicon; System-on-a-chip; antenna radiation patterns; artificial magnetic conductor (AMC); impedance matching; multi-chip mulii-core(MCMC);
Conference_Titel :
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-9398-2
Electronic_ISBN :
pending
DOI :
10.1109/EPEPS.2011.6100178
