DocumentCode
2602746
Title
Emerging technologies: 3D ICs & clock distribution (T-V)
Author
Gu, Xiaoxiong ; Rosenbaum, Elyse
Author_Institution
IBM, NY, USA
fYear
2011
fDate
23-26 Oct. 2011
Firstpage
85
Lastpage
86
Abstract
Start of the above-titled section of the conference proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
Conference_Location
San Jose, CA
ISSN
pending
Print_ISBN
978-1-4244-9398-2
Electronic_ISBN
pending
Type
conf
DOI
10.1109/EPEPS.2011.6100193
Filename
6100193
Link To Document