High-speed performance of Silicon Bridge die-to-die interconnects

Author

Braunisch, Henning ; Aleksov, Aleksandar ; Lotz, Stefanie ; Swan, Johanna

Author_Institution

Components Res., Intel Corp., Chandler, AZ, USA

fYear

2011

fDate

23-26 Oct. 2011

Firstpage

95

Lastpage

98

Abstract

Silicon Bridge is a dense multichip packaging architecture that enables high die-to-die interconnect density and corresponding applications. We describe the basic ideas of the concept, discuss density in the die-to-die interconnect context, and report results of electrical high-speed performance simulations, based on both two-dimensional and three-dimensional electromagnetic modeling.

Keywords

bridge circuits; chip scale packaging; elemental semiconductors; high-speed integrated circuits; integrated circuit interconnections; silicon; three-dimensional integrated circuits; die-to-die interconnect density; electrical high-speed performance simulations; multichip packaging architecture; silicon bridge die-to-die interconnects; three-dimensional electromagnetic modeling; two-dimensional electromagnetic modeling; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; Routing; Silicon; Solid modeling; Three dimensional displays; 3D interconnects; 3D packages; electronic packages; high-speed channels; multiconductor transmission lines; signal integrity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on

Conference_Location

San Jose, CA

ISSN

pending

Print_ISBN

978-1-4244-9398-2

Electronic_ISBN

pending

Type

conf

DOI

10.1109/EPEPS.2011.6100196

Filename

6100196