• DocumentCode
    2602984
  • Title

    High-Performance 45nm node CMOS Transistors Featuring Flash Lamp Annealing (FLA)

  • Author

    Sanuki, T. ; Iwamoto, T. ; Ota, K. ; Komoda, T. ; Yamazaki, H. ; Eiho, A. ; Miyagi, K. ; Nakayama, K. ; Fuji, O. ; Togo, M. ; Ohno, K. ; Yoshimura, H. ; Yoshida, K. ; Ito, T. ; Mineji, A. ; Yoshino, K. ; Itani, T. ; Matsuo, K. ; Sato, T. ; Mori, S. ; Naka

  • Author_Institution
    Toshiba Corp., Yokohama
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    281
  • Lastpage
    284
  • Abstract
    This paper describes the fabrication and performance of CMOS transistors featuring flash lamp annealing (FLA) for 45 nm node. We show, for the first time, applying FLA prior to spike RTA as S/D annealing is effective to enhance the channel stress in PFET with epitaxially grown SiGe (eSiGe) S/D. In NFET, FLA recovers the damaged layer in S/D extension caused by implantation and suppresses the transient enhanced diffusion (TED). These improvements result in 11% and 8% higher saturation drive current, and IDSAT=750muA/mum and 1160muA/mum for IOFF=100 nAmum at Vdd=lV in PFET and NFET, respectively. We also report the pattern density dependence of performance gain from FLA technique.
  • Keywords
    Ge-Si alloys; MOSFET; ion implantation; nanoelectronics; rapid thermal annealing; surface diffusion; CMOS transistors; SiGe; channel stress; flash lamp annealing; ion implantation; pattern density; performance gain; size 45 nm; transient enhanced diffusion; Annealing; CMOS logic circuits; CMOS technology; Capacitive sensors; Germanium silicon alloys; Indium tin oxide; Lamps; Performance gain; Silicon germanium; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2007. IEDM 2007. IEEE International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1507-6
  • Electronic_ISBN
    978-1-4244-1508-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2007.4418923
  • Filename
    4418923