• DocumentCode
    2603147
  • Title

    Random rough surface effects in interconnects studied by small perturbation theory in waveguide model

  • Author

    Ding, Ruihua ; Tsang, Leung ; Braunisch, Henning

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • fYear
    2011
  • fDate
    23-26 Oct. 2011
  • Firstpage
    161
  • Lastpage
    164
  • Abstract
    We study the effects of random roughness on wave propagation in a parallel plate metallic waveguide with finite conductivity. The rough surface is three dimensional (3D) with roughness heights varying in both horizontal directions. Integral equations are obtained from the extinction theorem formulated with layered medium Green´s function. The second order small perturbation method is then applied to solve the integral equations. A closed form expression for the coherent wave is derived, which is expressed in terms of a three-fold Sommerfeld type integral due to the waveguide structure. Approximate methods are applied to calculate the Sommerfeld integral. The coherent wave enhancement factors of absorption are computed. The results for waveguides are also compared with the results obtained for a plane wave incident on a metal surface with 3D roughness. Results are illustrated for 3D roughness with a variety of power spectra. It is shown that enhancement factors for a waveguide are larger than that of the plane wave case.
  • Keywords
    Green´s function methods; approximation theory; electromagnetic wave scattering; integral equations; perturbation theory; surface roughness; Green´s function; approximate methods; closed form expression; extinction theorem; finite conductivity; integral equations; parallel plate metallic waveguide; perturbation theory; random rough surface effects; random roughness; three-fold Sommerfeld type integral; wave propagation; waveguide model; Planar waveguides; Rough surfaces; Solid modeling; Surface roughness; Surface waves; Three dimensional displays; Random rough surface; enhancement factor; perturbation method; three dimensional; waveguide structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-9398-2
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/EPEPS.2011.6100215
  • Filename
    6100215