DocumentCode

2603365

Title

Multilayer Board Plated-Thru-Hole Failure Mechanisms

Author

Grabbe, Dimitry G.

Author_Institution

President, Maine Research Corporation, Lisbon, Maine 04250

fYear

1972

fDate

26390

Firstpage

188

Lastpage

192

Keywords

Bonding; Conductors; Contacts; Copper; Electronic components; Failure analysis; Integrated circuit interconnections; Laminates; Nonhomogeneous media; Palladium;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1972. 10th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1972.362550

Filename

4207922