DocumentCode :
2603390
Title :
Metallization Failures Caused by Organic Adhesives Used in Hybrid Microelectronic Devices
Author :
Spriggs, R.S. ; Cronshagen, A.H.
Author_Institution :
Reliability Engineer, Aerojet ElectroSystems Company, 1100 W. Hollyvale, Azusa, California 91702
fYear :
1972
fDate :
26390
Firstpage :
201
Lastpage :
203
Abstract :
Failures were experienced when organic adhesives were used to mount components in hybrid devices. These failures were determined to be caused by electrochemical reactions between constituents of the epoxy materials and substrate metallization. The failure mechanisms involved and the precautions necessary for their prevention are discussed in this paper.
Keywords :
Aluminum; Failure analysis; Inorganic materials; Integrated circuit interconnections; Metallization; Microelectronics; Packaging; Substrates; Temperature; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1972. 10th Annual
Conference_Location :
Las Vegas, NV, USA
ISSN :
0735-0791
Type :
conf
DOI :
10.1109/IRPS.1972.362552
Filename :
4207924
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2603390
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