• DocumentCode
    2603425
  • Title

    Functionalized multi-walled carbon nanotube coating on mainspring with reinforced mechanical strength

  • Author

    Gong, J.M. ; Choi, C.Y. ; Wong, K.W. ; Du, R.

  • Author_Institution
    Inst. of Precision of Eng., Chinese Univ. of Hong Kong, Hong Kong
  • fYear
    2007
  • fDate
    2-5 Aug. 2007
  • Firstpage
    53
  • Lastpage
    57
  • Abstract
    Here, we have successfully fabricated high performance mainspring by co-electrodeposition of functionalized multi-walled carbon nanotubes coating in the presence of chitosan. The functionalized multi-walled carbon nanotubes (f-MWCNTs) can be easily electro-deposited with chitosan onto the mainspring under a moderate condition, with controllable film thickness from a few hundred nanometers to tens of micrometers. The Young modulus of the coated mainspring was evaluated by a cantilever loading test. Our results show that the Young modulus of a mainspring coated with a f-MWCNT composite layer has been greatly improved. A 5 pm composite coating on a 100 mum mainspring (implying a 5 increase in the total thickness) can increase the Young modulus, by an average of 41.6%. The reported co-electrodeposition technique provides a facile approach to form stable, reproducible, and rigid f-MWCNTs composite coating, which leads to realization of high-performance mainspring with reinforced mechanical strength.
  • Keywords
    Young´s modulus; carbon nanotubes; coatings; composite materials; electrodeposition; mechanical strength; springs (mechanical); C; Young´s modulus; cantilever loading test; chitosan; co-electrodeposition; coated mainspring; composite coating; functionalized multiwalled carbon nanotube coating; reinforced mechanical strength; Carbon nanotubes; Coatings; Decision support systems; Nanotechnology; Quadratic programming; Virtual reality; carbon nanotubes; chitosan; mainspring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-0607-4
  • Electronic_ISBN
    978-1-4244-0608-1
  • Type

    conf

  • DOI
    10.1109/NANO.2007.4601139
  • Filename
    4601139