Integrated MEMS LC Resonator with Sealed Air-Suspended Structure for Single-Chip RF LSIs

Author

Kuwabara, K. ; Sato, N. ; Morimura, Hiroki ; Kodate, J. ; Nakamura, M. ; Ugajin, M. ; Kamei, T. ; Kudou, K. ; Machida, K. ; Ishii, H.

Author_Institution

NTT Corp., Atsugi

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

423

Lastpage

426

Abstract

This paper describes an integrated MEMS LC resonator that consists of a MEMS inductor and varactor. The resonator features a sealed air-suspended structure: the inductor and varactor are suspended above a CMOS LSI to improve their performance, and they are sealed with a film to protect them during packaging. The quality factor of the inductor is four times higher than that of a CMOS top-layer-metal inductor, and the varactor has a tuning ratio of 100% at about 5-V applied voltage. The resonator is applied to a voltage- controlled oscillator to show its effectiveness for the development of single-chip RF LSIs.

Keywords

CMOS integrated circuits; Q-factor; inductors; large scale integration; micromechanical resonators; radiofrequency integrated circuits; varactors; voltage-controlled oscillators; CMOS LSI; MEMS inductor; integrated MEMS LC resonator; quality factor; sealed air-suspended structure; single-chip RF LSI; varactor; voltage 5 V; voltage- controlled oscillator; Large scale integration; Micromechanical devices; Packaging; Protection; Q factor; Radio frequency; Tuning; Varactors; Voltage; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting, 2007. IEDM 2007. IEEE International

Conference_Location

Washington, DC

Print_ISBN

978-1-4244-1507-6

Electronic_ISBN

978-1-4244-1508-3

Type

conf

DOI

10.1109/IEDM.2007.4418963

Filename

4418963