• DocumentCode
    2603741
  • Title

    Torque and Theal Cycling as Methods of Testing Reliability of Reflow-Soldered Chip-To-Substlate Joints

  • Author

    Ailawadhi, Manohar L. ; Kakar, Ashok K.

  • Author_Institution
    Control Data Corporation, Microcircuits Operation, Bloomington, Minn.
  • fYear
    1973
  • fDate
    26755
  • Firstpage
    77
  • Lastpage
    82
  • Abstract
    Reflow-Soldering technology provides a low lost, high yield interconnection scheme for packaging monolithic integerated circuits. This paper gives the reliability data on such a package, test procedures used, and discusses some of the factors which influence the reliability of the package.
  • Keywords
    Capacitive sensors; Circuit testing; Fatigue; Packaging; Plastics; Rapid thermal processing; Temperature; Thermal expansion; Thermal stresses; Torque;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1973. 11th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1973.362570
  • Filename
    4207945
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2603741