• DocumentCode
    2603788
  • Title

    Some Reliability Considerations of Large Hybrids

  • Author

    McMahon, Robert E.

  • Author_Institution
    Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173
  • fYear
    1973
  • fDate
    26755
  • Firstpage
    91
  • Lastpage
    91
  • Abstract
    I assume that we all agree that a component does not become inherently less reliable when combined with other components, as in a hybrid, than it is singly. To think otherwise would be unscientific and perhaps even unAmerican. A component that has a particular failure rate when individually packaged should not have a higher failure rate in a hybrid assembly all things being equal. Unfortunately, not all things remain equal and perhaps that is the substance of the question before the panel.
  • Keywords
    Assembly; Hybrid integrated circuits; Inspection; Laboratories; Monolithic integrated circuits; Packaging; Reliability engineering; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1973. 11th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1973.362573
  • Filename
    4207948