DocumentCode
2603788
Title
Some Reliability Considerations of Large Hybrids
Author
McMahon, Robert E.
Author_Institution
Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts 02173
fYear
1973
fDate
26755
Firstpage
91
Lastpage
91
Abstract
I assume that we all agree that a component does not become inherently less reliable when combined with other components, as in a hybrid, than it is singly. To think otherwise would be unscientific and perhaps even unAmerican. A component that has a particular failure rate when individually packaged should not have a higher failure rate in a hybrid assembly all things being equal. Unfortunately, not all things remain equal and perhaps that is the substance of the question before the panel.
Keywords
Assembly; Hybrid integrated circuits; Inspection; Laboratories; Monolithic integrated circuits; Packaging; Reliability engineering; Temperature; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362573
Filename
4207948
Link To Document