DocumentCode

2603796

Title

IBM Reliability Experience With-Hybrid Microcircuits

Author

Totta, P.A.

Author_Institution

IBM System Products Division, East Fishkill, New York

fYear

1973

fDate

26755

Firstpage

92

Lastpage

92

Keywords

Aluminum; Business; Electromigration; Fatigue; Hybrid integrated circuits; IEEE news; Integrated circuit interconnections; Logic circuits; Packaging; Solids;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1973. 11th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1973.362574

Filename

4207949