• DocumentCode
    2603812
  • Title

    Reliability of Solder-Connected, Thick-Film Hybrid Integrated Circuits

  • Author

    Burks, Darnall P.

  • Author_Institution
    Sprague Electric Company, Wichita Falls, Texas
  • fYear
    1973
  • fDate
    26755
  • Firstpage
    93
  • Lastpage
    93
  • Keywords
    Ceramics; Conducting materials; Hybrid integrated circuits; Integrated circuit packaging; Integrated circuit reliability; Lead; Military computing; Substrates; Thermal stresses; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1973. 11th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1973.362575
  • Filename
    4207950
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2603812