DocumentCode
2603977
Title
Direct evaluation of DC characteristic variability in FinFET SRAM Cell for 32 nm node and beyond
Author
Inaba, Satoshi ; Kawasaki, Hirohisa ; Okano, Kimitoshi ; Izumida, Takashi ; Yagishita, Atsushi ; Kaneko, Akio ; Ishimaru, Kazunari ; Aoki, Nobutoshi ; Toyoshima, Yoshiaki
Author_Institution
TOSHIBA Corp. Semicond. Co., Yokohama
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
487
Lastpage
490
Abstract
Vt variability in FinFET SRAM is evaluated for the first time by direct measurement of the cell transistors down to 25 nm gate length. By taking the V, mismatch between Pull-Down transistors (PD) or between PD & Pass Gate transistor (PG), the dependence of V, variability on the cell transistor layout and channel impurity concentration was clearly observed. Read / Write margins in FinFET SRAM cell are also investigated by measuring both N-curves and their variability. The results suggest that FinFET is still a promising candidate for SRAM applications even in 32 nm node and beyond, if the appropriate cell design is applied.
Keywords
MOS memory circuits; MOSFET; SRAM chips; integrated circuit design; nanoelectronics; semiconductor device measurement; CMOS device; FinFET SRAM cell design; N-curve measurement; cell transistor measurement; channel impurity concentration; pass gate transistor; pull-down transistors; read-write margin; size 25 nm; size 32 nm; Fabrication; FinFETs; Implants; Impurities; Length measurement; MOSFETs; Nearest neighbor searches; Random access memory; Substrates; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-1507-6
Electronic_ISBN
978-1-4244-1508-3
Type
conf
DOI
10.1109/IEDM.2007.4418980
Filename
4418980
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