DocumentCode

2604187

Title

Reliability Improvements of Plastic Semiconductors using Gold Metallization

Author

Wright, James C.

Author_Institution

MOTOROLA, SEMICONDUCTOR PRODUCTS DIVISION, PHOENIX, ARIZONA 85062

fYear

1973

fDate

26755

Firstpage

224

Lastpage

229

Keywords

Aluminum; Assembly; Bonding; Gold; Metallization; Plastics; Semiconductor device reliability; Silicon; Switches; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1973. 11th Annual

Conference_Location

Las Vegas, NV, USA

ISSN

0735-0791

Type

conf

DOI

10.1109/IRPS.1973.362600

Filename

4207975