DocumentCode
2604224
Title
High-Reliability Plastic Package for Integrated Circuits
Author
Khajezadeh, H.
Author_Institution
Manager, Linear IC Product Development, RCA Solid State, Somerville, N.J., 08876
fYear
1973
fDate
26755
Firstpage
236
Lastpage
244
Abstract
Two orders of magnitude improvement in the reliability of plastic packages has been achieved as the result of a systematic study of basic failure mechanisms and the development of improved materials, handling procedures and process controls. This improved integrated-circuit packaging system has resulted in plastic-encapsulated product capable of matching the reliability of hermetic packages under severe environmental stress.
Keywords
Bonding; Ceramics; Circuit testing; Failure analysis; Gold; Integrated circuit reliability; Plastic integrated circuit packaging; Plastic packaging; Plastics industry; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362602
Filename
4207977
Link To Document