• DocumentCode
    2604241
  • Title

    A Current Pulse Screening Test for Metal Step Coverage

  • Author

    Gurev, Harold S.

  • Author_Institution
    Senior Scientist, Materials Research Laboratory, Motorola Semiconductor Products Division, 5005 E. McDowell Road, Phoenix, Az 85008
  • fYear
    1973
  • fDate
    26755
  • Firstpage
    245
  • Lastpage
    253
  • Abstract
    The response of aluminum thin films to single shot, constant current pulses was investigated to seek a ZAP test method for screening out inadequate metal coverage. At current density J, constant cross section stripes melt and open in time durations, tm and to respectively, which obey adiabatic heating laws J2tm - Km and J2to = Ko if heating time is sufficiently brief to minimize heat loss to the substrate. During ZAP testing of metal stripes, which have reduced cross sections as they cover oxide steps, the heat input needed to open the thin spots was significantly greater than predicted values because of lateral heat flow to the thicker portions of the metal stripes. However, the test method is capable of readily differentiating, in 7KÃ… to 10KÃ… A1 films, stripes with 30% step coverage from those with 45% coverage (and both from flat, 100% coverage, metal) solely by the measured burnout time. In summary, the potential utility of ZAP testing as a metal coverage screen was demonstrated.
  • Keywords
    Aluminum; Etching; Inspection; Materials testing; Monitoring; Process control; Scanning electron microscopy; Semiconductor device testing; Surfaces; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1973. 11th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1973.362603
  • Filename
    4207978