DocumentCode
2604241
Title
A Current Pulse Screening Test for Metal Step Coverage
Author
Gurev, Harold S.
Author_Institution
Senior Scientist, Materials Research Laboratory, Motorola Semiconductor Products Division, 5005 E. McDowell Road, Phoenix, Az 85008
fYear
1973
fDate
26755
Firstpage
245
Lastpage
253
Abstract
The response of aluminum thin films to single shot, constant current pulses was investigated to seek a ZAP test method for screening out inadequate metal coverage. At current density J, constant cross section stripes melt and open in time durations, tm and to respectively, which obey adiabatic heating laws J2tm - Km and J2to = Ko if heating time is sufficiently brief to minimize heat loss to the substrate. During ZAP testing of metal stripes, which have reduced cross sections as they cover oxide steps, the heat input needed to open the thin spots was significantly greater than predicted values because of lateral heat flow to the thicker portions of the metal stripes. However, the test method is capable of readily differentiating, in 7KÃ
to 10KÃ
A1 films, stripes with 30% step coverage from those with 45% coverage (and both from flat, 100% coverage, metal) solely by the measured burnout time. In summary, the potential utility of ZAP testing as a metal coverage screen was demonstrated.
Keywords
Aluminum; Etching; Inspection; Materials testing; Monitoring; Process control; Scanning electron microscopy; Semiconductor device testing; Surfaces; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362603
Filename
4207978
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