DocumentCode
2604314
Title
Dynamic Thermal Properties of IMPATT Diodes
Author
Rossiter, Thomas J.
Author_Institution
Reliability Branch, Rome Air Development Center, Griffiss AFB NY 13441
fYear
1973
fDate
26755
Firstpage
275
Lastpage
281
Abstract
Dynamic heating effects in IMPATT diodes were studied for pulse applications, comparing. the thermal characteristics of various commercial device construction techniques. The study considered temperature distribution effects resulting from nonuniform heat flow and power dissipation due to both perfect and imperfect die mounting. A testing technique is proposed which can accurately measure the average junction temperature as a function of time by monitoring the I-V operating point.
Keywords
Copper; Flip chip; Heat sinks; Impedance measurement; Packaging; Schottky diodes; Semiconductor diodes; Silicon; Temperature; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1973. 11th Annual
Conference_Location
Las Vegas, NV, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1973.362607
Filename
4207982
Link To Document