Title :
Effect of process variation on field emission characteristic in surface conduction electron-emitters
Author :
Lo, Hsiang-Yu ; Li, Yiming ; Chao, Hsueh-Yung ; Tsai, Chih-Hao ; Pan, Fu-Ming
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu
Abstract :
In this work, we explore the effect of process variation on field emission characteristics in surface conduction electron-emitters. The structure of palladium thin-film emitter is fabricated on the substrate and the nanometer scaled gap is formed by the focused ion beam (FIB) technique. Different shapes of nanogaps due to the process variations are investigated by the experiment and 3D Maxwell particle-in-cell simulation. Four deformation structures are examined, and it is found that the Type 1 exhibits high emission efficiency due to a stronger electric field around the apex and larger the emission current among structures. The electron emission current is dependent upon the angle of inclination of surface.
Keywords :
Maxwell equations; deformation; electrodes; electron field emission; focused ion beam technology; metallic thin films; nanotechnology; palladium; surface conductivity; 3D Maxwell particle-in-cell simulation; Pd; deformation structures; deformed palladium nanogaps; electron emission current; emission efficiency; field emission characteristics; focused ion beam technique; palladium thin-film emitter structure; process variation effect; surface conduction electron-emitters; Electrodes; Electron emission; Electron guns; Fabrication; Finite difference methods; Ion beams; Palladium; Substrates; Surface morphology; Transistors; focused ion beam; palladium; particle-in-cell simulation; process variation; surface conduction electron emitter;
Conference_Titel :
Nanotechnology, 2007. IEEE-NANO 2007. 7th IEEE Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-0607-4
Electronic_ISBN :
978-1-4244-0608-1
DOI :
10.1109/NANO.2007.4601207
