• DocumentCode
    2604694
  • Title

    Reliability Considerations in the Design and Fabrication of Polysilicon Fusable Link Prom´s

  • Author

    Parker, G.H. ; Cornet, J.C. ; Pinter, W.S.

  • Author_Institution
    Intel Corporation, 3065 Bowers Avenue, Santa Clara, California 95051
  • fYear
    1974
  • fDate
    27120
  • Firstpage
    88
  • Lastpage
    89
  • Abstract
    This paper describes some of the design and fabrication considerations in a 1024 bit programmable read only memory. The memory element in the PROM is a fusible link consisting of a notched stripe of poly crystalline silicon., A portion of the array is shown in Figure 1 depicting approximately eight cells. Each cell consists of a fusible link and a bipolar transistor. A cross section of the transistor and fuse is shown in Figure 2. Fabrication of the array follows the normal bipolar processing through the emitter step. At that point the poly crystalline silicon is deposited by standard silicon gate MOS techniques. The thickness is nominally 3KÃ… After deposition, the fusible links are delineated with normal photo lithography with a notch width target of 2 microns. By suitable process control, including visual inspection of each wafer, this fuse dimension is routinely achievable. As an aid to width control, a resolution pattern is included on the photo mask. The fuse is then doped to the desired resistivity and the remaining processing again follows a standard flow of contact and metallization steps.
  • Keywords
    Bipolar transistors; Conductivity; Crystallization; Fabrication; Fuses; Inspection; Lithography; PROM; Process control; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1974. 12th Annual
  • Conference_Location
    Las Vegas, NV, USA
  • ISSN
    0735-0791
  • Type

    conf

  • DOI
    10.1109/IRPS.1974.362633
  • Filename
    4208011