Title :
"The Reliability of Epoxy as a Die Attach in Digital and Linear Integrated Circuits"
Author :
Pietrucha, Bernard M. ; Reiss, Eugene M.
Author_Institution :
RCA Solid State Division, Rt. 202, Somerville, N.J.
Abstract :
The implementation and advantages of epoxy die-attach are described with special emphasis given to areas of mechanical integrity and product stability. A recent special test program indicates that the epoxy die-attach process results in reliable product.
Keywords :
Analog integrated circuits; Integrated circuit reliability; Manufacturing; Microassembly; Packaging; Silver; Stress; Temperature; Testing; Thermal conductivity;
Conference_Titel :
Reliability Physics Symposium, 1974. 12th Annual
Conference_Location :
Las Vegas, NV, USA
DOI :
10.1109/IRPS.1974.362651
