DocumentCode
2605585
Title
Simultaneous Extraction of Recoverable and Permanent Components Contributing to Bias-Temperature Instability
Author
Grasser, T. ; Kaczer, B. ; Hehenberger, P. ; Gös, W. ; O´Connor, R. ; Reisinger, H. ; Gustin, Wolfgang ; Schunder, C.
Author_Institution
TU Wien, Vienna
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
801
Lastpage
804
Abstract
Measuring the degradation of modern devices subjected to bias temperature stress has turned out to be a formidable challenge. Interestingly, measurement techniques such as fast- Vth, on-the-fly ID,lin, and charge-pumping give quite different results. This has often been explained by the inherent recovery in non-on-the-fly techniques. Still, all these techniques deliver important information on the degradation and recovery behavior and a rigorous understanding linking these results is still missing. Based on our detailed studies of the recovery, we propose a new measurement technique which allows the simultaneous extraction of two distinctly different components, a fast universally recovering component and a slow, nearly permanent component.
Keywords
MOSFET; recovery; semiconductor device measurement; thermal stability; thermal stresses; MOS transistors; bias temperature stress; bias-temperature instability; device degradation measurement; measurement techniques; permanent components; recoverable components extraction; recovery behavior; transistor parameters; Charge pumps; Data mining; Degradation; Laboratories; MOSFETs; Measurement techniques; Plasma measurements; Plasma temperature; Pulse measurements; Stress measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-1507-6
Electronic_ISBN
978-1-4244-1508-3
Type
conf
DOI
10.1109/IEDM.2007.4419069
Filename
4419069
Link To Document