DocumentCode :
2605663
Title :
Impact of TiN Metal gate on NBTI assessed by interface states and fast transient effect characterization
Author :
Rafik, M. ; Garros, X. ; Ribes, G. ; Ghibaudo, G. ; Hobbs, C. ; Zauner, A. ; Muller, M. ; Huard, V. ; Ouvard, C.
Author_Institution :
STMicroelectronics, Crolles
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
825
Lastpage :
828
Abstract :
With the decrease of the high-k layer thickness, NBTI becomes more critical than PBTI. The relative contribution of interface states and trapping on NBTI is analysed in Hf-based stacks. Dit density and generation kinetics were found to be similar to that in SiO2, whereas a very large fast trapping component was evidenced. The pre-existing traps responsible for this fast trapping effect were related to N incorporation in the interfacial layer after TiN PVD deposition. Finally, a significant lifetime improvement is achieved using TaC as gate material.
Keywords :
MOSFET; hafnium; high-k dielectric thin films; hole traps; interface states; semiconductor device measurement; semiconductor device models; semiconductor device reliability; sputter deposition; tantalum compounds; thermal stability; thermal stresses; titanium compounds; transients; CMOS process; Hf-TiN; NBTI; PVD deposition; TaC; fast transient effect characterization; fast trapping component; gate material; hafium-based stacks; high-k layer thickness; interface states; interface trap density; interface trap generation kinetics; lifetime improvement; metal gate impact; Charge pumps; Degradation; Dielectric measurements; High K dielectric materials; High-K gate dielectrics; Interface states; Niobium compounds; Stress; Tin; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2007. IEDM 2007. IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4244-1507-6
Electronic_ISBN :
978-1-4244-1508-3
Type :
conf
DOI :
10.1109/IEDM.2007.4419075
Filename :
4419075
Link To Document :
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